- 接触面厚度-配合 :
- 接触材料-配合 :
- 已选择过滤 :
8 产品
| 图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | 系列 | 零件状态 | 包装材料 | 工作温度 | 安装类型 | 结束 | 特征 | 类型 | 外壳材料 | 节距配合 | 触点表面处理-配合 | 接触面厚度-配合 | 接触面-立柱 | 位置或引脚数（网格） | 接触材料-配合 | 接触面厚度-立柱 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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获得报价 |
3,088
有现货
|
Preci-Dip | CONN SOCKET BGA 292POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 292 (20 x 20) | Beryllium Copper | - | ||
|
|
|
获得报价 |
2,710
有现货
|
Preci-Dip | CONN SOCKET BGA 292POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 292 (20 x 20) | Beryllium Copper | - | ||
|
|
|
获得报价 |
946
有现货
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | ||
|
|
|
获得报价 |
1,803
有现货
|
Preci-Dip | CONN SOCKET PGA 292POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 292 (20 x 20) | Beryllium Copper | Flash | ||
|
|
|
获得报价 |
2,313
有现货
|
Preci-Dip | CONN SOCKET PGA 292POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 292 (20 x 20) | Beryllium Copper | Flash | ||
|
|
|
获得报价 |
1,498
有现货
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Brass | 10.0µin (0.25µm) | ||
|
|
|
获得报价 |
3,225
有现货
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | ||
|
|
|
获得报价 |
1,699
有现货
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Brass | 10.0µin (0.25µm) |
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