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443 产品
图片 型号 价格 数量 库存 制造商 描述 系列 零件状态 包装材料 工作温度 安装类型 结束 特征 类型 外壳材料 节距配合 触点表面处理-配合 接触面厚度-配合 接触面-立柱 位置或引脚数(网格) 接触材料-配合 接触面厚度-立柱 联系材料-职位
2-382468-4
获得报价
RFQ
2,801
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
Default Photo
获得报价
RFQ
2,161
有现货
3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 40 (2 x 20) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
AR40-HZL-TT
获得报价
RFQ
3,203
有现货
Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZW/T
获得报价
RFQ
3,115
有现货
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
A40-LCG
获得报价
RFQ
1,037
有现货
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete - - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 40 (2 x 20) - - -
2-640379-4
获得报价
RFQ
1,057
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
40-516-10
获得报价
RFQ
3,434
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
C9140-00
获得报价
RFQ
2,658
有现货
Aries Electronics CONN IC DIP SOCKET 40POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C8140-04
获得报价
RFQ
2,107
有现货
Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
单位
$36.88
获得报价
RFQ
3,138
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
单位
$36.88
获得报价
RFQ
3,259
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
单位
$36.88
获得报价
RFQ
3,354
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
单位
$36.88
获得报价
RFQ
2,831
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
单位
$36.88
获得报价
RFQ
3,847
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
单位
$36.88
获得报价
RFQ
2,874
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 40 (2 x 20) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
单位
$35.75
获得报价
RFQ
1,057
有现货
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
获得报价
RFQ
1,242
有现货
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
获得报价
RFQ
2,500
有现货
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
获得报价
RFQ
3,463
有现货
3M CONN IC DIP SOCKET 40POS GOLD 400 Obsolete - - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 40 (2 x 20) - 8.00µin (0.203µm) -
1825109-3
获得报价
RFQ
2,096
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 40 (2 x 20) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
Default Photo
获得报价
RFQ
1,816
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 40 (2 x 20) Beryllium Copper - Brass
Default Photo
获得报价
RFQ
1,065
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - - -
Default Photo
获得报价
RFQ
1,438
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - - -
Default Photo
获得报价
RFQ
2,839
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 40 (2 x 20) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
4-382568-0
获得报价
RFQ
3,410
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
Default Photo
获得报价
RFQ
1,583
有现货
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - - 40 (2 x 20) Copper Alloy - -
Default Photo
获得报价
RFQ
2,933
有现货
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 40 (2 x 20) Beryllium Copper Flash Brass
Default Photo
单位
$66.77
获得报价
RFQ
1,612
有现货
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
获得报价
RFQ
2,994
有现货
3M CONN IC DIP SOCKET 40POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 40 (2 x 20) Beryllium Copper Flash Brass
Default Photo
获得报价
RFQ
1,091
有现货
3M CONN IC DIP SOCKET 40POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
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