- 零件状态 :
- 接触面厚度-配合 :
- 位置或引脚数(网格) :
- 已选择过滤 :
18 产品
图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | 系列 | 零件状态 | 包装材料 | 工作温度 | 安装类型 | 结束 | 特征 | 类型 | 外壳材料 | 节距配合 | 触点表面处理-配合 | 接触面厚度-配合 | 位置或引脚数(网格) | 接触材料-配合 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
获得报价 |
2,644
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | |||
|
获得报价 |
1,927
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
3,434
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
|
获得报价 |
2,515
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
|
获得报价 |
2,929
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
|
获得报价 |
3,518
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
2,216
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
|
获得报价 |
1,991
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | |||
|
获得报价 |
2,419
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | |||
|
获得报价 |
2,758
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
2,182
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
2,858
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
1,734
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | |||
|
获得报价 |
2,597
有现货
|
3M | CONN IC DIP SOCKET ZIF 90POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 90 (2 x 45) | Beryllium Copper | |||
|
获得报价 |
2,933
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 516 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
|
获得报价 |
2,476
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | |||
|
获得报价 |
2,265
有现货
|
Adafruit Industries LLC | 40-PIN ZIF SOCKET | - | Active | - | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | - | - | Gold | - | 40 (2 x 20) | - | |||
|
获得报价 |
1,611
有现货
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper |