- 零件状态 :
- 安装类型 :
- 结束 :
51 产品
| 图片 | 型号 | 价格 | 数量 | 库存 | 制造商 | 描述 | 系列 | 零件状态 | 包装材料 | 工作温度 | 安装类型 | 结束 | 特征 | 类型 | 外壳材料 | 节距配合 | 触点表面处理-配合 | 接触面厚度-配合 | 位置或引脚数（网格） | 接触材料-配合 | 联系材料-职位 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
获得报价 |
1,924
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 32 (1 x 32) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,864
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 40 (2 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
839
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,076
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | - | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 32 (1 x 32) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,261
有现货
|
Omron Electronics Inc-EMC Div | CONN IC SOCKET 20POS | XR2 | Obsolete | Bulk | -55°C ~ 125°C | - | Solder | Closed Frame | Housing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | - | - | 20 (1 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,390
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,885
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,427
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (1 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,927
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (1 x 32) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
3,264
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,026
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,188
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,942
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
1,221
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,824
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
3,459
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
3,863
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,585
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (1 x 32) | Beryllium Copper | Beryllium Copper | ||
|
|
获得报价 |
3,819
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | ||
|
|
获得报价 |
3,876
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
1,961
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
2,355
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 24 (2 x 12) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
1,551
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 24 (2 x 12) | Beryllium Copper | Brass | ||
|
|
|
获得报价 |
1,932
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,584
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,716
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
1,586
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 20 (1 x 20) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
2,631
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 14POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
3,690
有现货
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 32 (2 x 16) | Beryllium Copper | Beryllium Copper | ||
|
|
|
获得报价 |
676
有现货
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (1 x 16) | Beryllium Copper | Beryllium Copper |
粤ICP备2022113175号-1